Ukusetyenziswa kwenitrogen kushishino lweSMT

I-SMT patch ibhekisa kwisifinyezo sothotho lweenkqubo ezisekelwe kwiPCB. I-PCB (iBhodi yeSekethe eprintiweyo) yibhodi yesekethe eprintiweyo.

I-SMT sisishunqulelo seSurface Mounted Technology, eyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane. Itekhnoloji yokudibanisa umphezulu wesekethe ye-elektroniki (i-Surface Mount Technology, i-SMT) ibizwa ngokuba yi-surface mount okanye iteknoloji yokunyuswa komphezulu. Yindlela yokufakela amacandelo angenayo i-lead okanye i-short-lead surface-mounted (ebizwa ngokuba yi-SMC / SMD, ebizwa ngokuba yi-chip components ngesiTshayina) phezu kwebhodi yesekethe eprintiweyo (PCB) okanye enye i-substrate. Itekhnoloji yendibano yesiphaluka edityaniswe ngokuxutywa kusetyenziswa iindlela ezifana ne-reflow soldering okanye idip soldering.

Kwinkqubo ye-welding ye-SMT, i-nitrogen ifanelekile ngokugqithisileyo njengegesi yokukhusela. Isizathu esona sizathu kukuba amandla ayo adibeneyo aphakamileyo, kwaye ukuphendulwa kweekhemikhali kuya kwenzeka kuphela phantsi kobushushu obuphezulu kunye noxinzelelo oluphezulu (> 500C,> 100bar) okanye ngokongezwa kwamandla.

Ijenereyitha yenitrogen okwangoku sesona sixhobo sifanelekileyo sokuvelisa initrogen esisetyenziswa kushishino lweSMT. Njengesixhobo sokuvelisa initrogen kwisiza, i-nitrogen generator izenzekela ngokupheleleyo kwaye ingahoywanga, inobomi obude, kwaye inezinga eliphantsi lokungaphumeleli. Kukulungele kakhulu ukufumana i-nitrogen, kwaye iindleko nazo ziphantsi phakathi kweendlela zangoku zokusebenzisa i-nitrogen!

Abavelisi beMveliso yeNitrojeni - iChina iNitrogen Production Factory & Suppliers (xinfatools.com)

I-nitrojeni isetyenzisiwe kwi-reflow soldering ngaphambi kokuba kusetyenziswe igesi engasebenziyo kwinkqubo yokuthengiswa kwamaza. Inxalenye yesizathu kukuba umzi-mveliso we-IC oxutyiweyo kudala wasebenzisa i-nitrogen kwi-solder ephinda iphinde ifakwe kwi-solder-mount ye-ceramic hybrid circuits. Xa ezinye iinkampani zabona izibonelelo zokwenziwa kwe-IC hybrid, zasebenzisa lo mgaqo kwi-PCB soldering. Kolu hlobo lwe-welding, i-nitrogen nayo ithatha indawo ye-oksijini kwinkqubo. I-Nitrogen inokwaziswa kuyo yonke indawo, kungekhona nje kwindawo yokubuyisela, kodwa kunye nokupholisa inkqubo. Uninzi lweenkqubo zokubuyela kwakhona ngoku zilungele i-nitrogen; ezinye iinkqubo zinokuphuculwa ngokulula ukuze zisebenzise inaliti yegesi.

Ukusebenzisa initrogen kwi-reflow soldering kunezi nzuzo zilandelayo:

‧Ukumanzisa okukhawulezayo kweetheminali kunye neepads

‧Utshintsho oluncinci ekuthengiseni

‧Uphuculo lwenkangeleko yentsalela eguquguqukayo kunye nomphezulu odibeneyo we-solder

‧ Ukupholisa okuKhawulezayo ngaphandle kobhedu oxidation

Njengegesi ekhuselayo, indima ephambili ye-nitrogen ekudibaniseni i-oksijini kukuphelisa i-oksijini ngexesha lenkqubo ye-welding, ukwandisa i-weldability, kunye nokukhusela i-oxidation kwakhona. Kwi-welding ethembekileyo, ngaphezu kokukhetha i-solder efanelekileyo, intsebenziswano ye-flux iyafuneka ngokubanzi. I-flux isusa kakhulu i-oxides kwi-welding inxalenye yecandelo le-SMA ngaphambi kwe-welding kwaye inqande ukuphinda kufakwe i-oxidation ye-welding part, kwaye yenze iimeko ezintle zokumanzisa kwi-solder ukuphucula i-solderability. . Uvavanyo lubonise ukuba ukongeza i-asidi ye-formic phantsi kokukhusela i-nitrogen kunokufikelela kwimiphumo engentla. Umsesane we-nitrogen wave soldering machine owamkela itonela-uhlobo lwesakhiwo setanki ye-welding ikakhulu itanki yokulungisa itonela. Isigqubuthelo esingaphezulu senziwe ngamaqhekeza amaninzi eglasi evulelekayo ukuqinisekisa ukuba ioksijini ayinakungena kwitanki yokulungisa. Xa i-nitrogen ifakwe kwi-welding, isebenzisa imilinganiselo eyahlukeneyo yegesi ekhuselayo kunye nomoya, i-nitrogen iya kuqhuba ngokuzenzekelayo umoya ngaphandle kwendawo ye-welding. Ngethuba lenkqubo ye-welding, ibhodi ye-PCB iya kuzisa ngokuqhubekayo i-oksijini kwindawo ye-welding, ngoko ke i-nitrogen kufuneka ifakwe ngokuqhubekayo kwindawo ye-welding ukwenzela ukuba i-oksijini ikhutshwe ngokuqhubekayo kwi-outlet.

Itekhnoloji ye-nitrojeni kunye ne-fomic acid idla ngokusetyenziswa kwiziko lohlobo lwetonela lokuphinda liqukunjelwe kunye nokuxubana kwe-convection eyandisiweyo. I-inlet kunye ne-outlet ziyilelwe ngokubanzi ukuba zivuleke, kwaye kukho amakhethini amaninzi eminyango ngaphakathi kunye nokutywinwa okulungileyo, okunokufudumala kunye nokushisa kwangaphambili. Ukomisa, ukuphinda kufakwe i-solder kunye nokupholisa zonke zigqityiwe kwitonela. Kulo moya oxubeneyo, i-solder paste esetyenzisiweyo ayifuni ukuba ne-activators, kwaye akukho ntsalela ishiywe kwi-PCB emva kokuthengiswa. Ukunciphisa i-oxidation, ukunciphisa ukubunjwa kweebhola ze-solder, kwaye akukho bhuloho, eluncedo kakhulu kwi-welding ye-pitch-pitch yezixhobo. Igcina izixhobo zokucoca kwaye ikhusela imo engqongileyo yehlabathi. Iindleko ezongezelelweyo ezenziwe yi-nitrogen zihlawuleka ngokulula kwiindleko zokongiwa ezivela kwiziphene ezincitshisiweyo kunye neemfuno zabasebenzi.

I-Wave soldering kunye ne-reflow soldering phantsi kokhuseleko lwe-nitrogen iya kuba yitekhnoloji ephambili kwindibano yomphezulu. Iring nitrogen wave soldering machine idityaniswe neteknoloji yefomic acid, kwaye i-nitrogen reflow soldering machine idityaniswe nomsebenzi ophantsi kakhulu we-solder paste kunye ne-formic acid, enokususa inkqubo yoCoca. Kwiteknoloji ye-welding ye-SMT ephuhliswayo ngokukhawuleza, ingxaki ephambili edibene nayo yindlela yokususa i-oxides, ukufumana indawo ecocekileyo yezinto ezisisiseko, kunye nokufezekisa uxhulumaniso oluthembekileyo. Ngokuqhelekileyo, i-flux isetyenziselwa ukususa i-oxides, ukunyakamisa umphezulu womhlaba ukuba uthengiselwe, ukunciphisa ukuxinana komphezulu we-solder, kunye nokuthintela ukuphinda kufakwe i-oxidation. Kodwa kwangaxeshanye, i-flux iya kushiya intsalela emva kokuthengiswa, kubangele iziphumo ezibi kumacandelo e-PCB. Ngoko ke, ibhodi yesekethe kufuneka icocwe ngokucokisekileyo. Nangona kunjalo, ubungakanani be-SMD buncinci, kwaye umsantsa phakathi kweendawo ezingathengiswanga uya usiba mncinci kwaye uncinci. Ukucoca ngokucokisekileyo akusenakwenzeka. Okubaluleke ngakumbi kukhuseleko lwendalo esingqongileyo. Ii-CFCs zibangela umonakalo kucwecwe lwe-ozone ye-atmospheric, kwaye ii-CFCs njengeyona arhente iphambili yokucoca kufuneka ivalwe. Indlela esebenzayo yokusombulula ezi ngxaki zingentla kukwamkela iteknoloji engacocekanga kwindawo yokuhlanganisana nge-elektroniki. Ukongeza ixabiso elincinci kunye nenani le-formic acid ye-HCOOH kwi-nitrogen ibonakalise ukuba yindlela esebenzayo yokungacoceki engadingi naluphi na ukucoca emva kwe-welding, ngaphandle kwemiphumo emibi okanye nayiphi na inkxalabo malunga neentsalela.