Ukusetyenziswa kwenitrogen kushishino lweSMT

I-SMT patch ibhekisa kwisifinyezo sothotho lweenkqubo ezisekelwe kwiPCB.I-PCB (iBhodi yeSekethe eprintiweyo) yibhodi yesekethe eprintiweyo.

I-SMT sisishunqulelo seSurface Mounted Technology, eyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane.Itekhnoloji yokudibanisa umphezulu wesekethe ye-elektroniki (i-Surface Mount Technology, i-SMT) ibizwa ngokuba yi-surface mount okanye iteknoloji yokunyuswa komphezulu.Yindlela yokufakela amacandelo angenayo i-lead okanye i-short-lead surface-mounted (ebizwa ngokuba yi-SMC / SMD, ebizwa ngokuba yi-chip components ngesiTshayina) phezu kwebhodi yesekethe eprintiweyo (PCB) okanye enye i-substrate.Itekhnoloji yendibano yesiphaluka edityaniswe ngokuxutywa kusetyenziswa iindlela ezifana ne-reflow soldering okanye idip soldering.

Kwinkqubo ye-welding ye-SMT, i-nitrogen ifanelekile ngokugqithisileyo njengegesi yokukhusela.Isizathu esona sizathu kukuba amandla ayo adibeneyo aphezulu, kwaye ukuphendulwa kweekhemikhali kuya kwenzeka kuphela phantsi kobushushu obuphezulu kunye noxinzelelo oluphezulu (> 500C,> 100bar) okanye ngokongezwa kwamandla.

Ijenereyitha yenitrogen okwangoku sesona sixhobo sifanelekileyo sokuvelisa initrogen esisetyenziswa kushishino lweSMT.Njengesixhobo sokuvelisa initrogen kwisiza, i-nitrogen generator izenzekela ngokupheleleyo kwaye ingahoywanga, inobomi obude, kwaye inezinga eliphantsi lokungaphumeleli.Kukulungele kakhulu ukufumana i-nitrogen, kwaye iindleko nazo ziphantsi phakathi kweendlela zangoku zokusebenzisa i-nitrogen!

Abavelisi beMveliso yeNitrojeni - iChina iNitrogen Production Factory & Suppliers (xinfatools.com)

I-nitrojeni isetyenzisiwe kwi-reflow soldering ngaphambi kokuba kusetyenziswe igesi engasebenziyo kwinkqubo yokuthengiswa kwamaza.Inxalenye yesizathu kukuba umzi-mveliso we-IC oxutyiweyo kudala wasebenzisa i-nitrogen kwi-solder ephinda iphinde ifakwe kwi-solder-mount ye-ceramic hybrid circuits.Xa ezinye iinkampani zabona izibonelelo zokwenziwa kwe-IC hybrid, zasebenzisa lo mgaqo kwi-PCB soldering.Kolu hlobo lwe-welding, initrogen nayo ithatha indawo yeoksijini kwinkqubo.I-Nitrogen inokwaziswa kuyo yonke indawo, kungekhona nje kwindawo yokubuyisela kwakhona, kodwa kunye nokupholisa inkqubo.Uninzi lweenkqubo zokugalela kwakhona ngoku zilungele initrogen;ezinye iinkqubo zinokuphuculwa ngokulula ukuze zisebenzise inaliti yegesi.

Ukusebenzisa initrogen kwi-reflow soldering kunezi nzuzo zilandelayo:

‧Ukumanzisa okukhawulezayo kweetheminali kunye neepads

‧Utshintsho oluncinci ekuthengiseni

‧Imbonakalo ephuculweyo yentsalela eguquguqukayo kunye nomphezulu odityanisiweyo we-solder

‧ Ukupholisa okuKhawulezayo ngaphandle kwe oxidation yobhedu

Njengegesi ekhuselayo, indima ephambili ye-nitrogen ekudibaniseni i-oksijini kukuphelisa i-oksijini ngexesha lenkqubo ye-welding, ukwandisa i-weldability, kunye nokukhusela i-oxidation kwakhona.Kwi-welding ethembekileyo, ngaphezu kokukhetha i-solder efanelekileyo, intsebenziswano ye-flux iyafuneka ngokubanzi.I-flux isusa kakhulu i-oxides kwi-welding inxalenye yecandelo le-SMA phambi kwe-welding kwaye inqande ukuphinda kufakwe i-oxidation ye-welding part, kwaye yenze iimeko ezintle zokumanzisa kwi-solder ukuphucula i-solderability..Uvavanyo lubonise ukuba ukongeza i-asidi ye-formic phantsi kokukhusela i-nitrogen kunokufikelela kwimiphumo engentla.Umsesane we-nitrogen wave soldering machine owamkela itonela-uhlobo lwesakhiwo setanki ye-welding ikakhulu itanki yokulungisa itonela.Isigqubuthelo esingaphezulu senziwe ngamaqhekeza amaninzi eglasi evulelekayo ukuqinisekisa ukuba ioksijini ayinakungena kwitanki yokulungisa.Xa i-nitrogen ifakwe kwi-welding, isebenzisa imilinganiselo eyahlukeneyo yegesi ekhuselayo kunye nomoya, i-nitrogen iya kuqhuba ngokuzenzekelayo umoya ngaphandle kwendawo ye-welding.Ngethuba lenkqubo ye-welding, ibhodi ye-PCB iya kuzisa ngokuqhubekayo i-oksijini kwindawo ye-welding, ngoko ke i-nitrogen kufuneka iqhutywe ngokuqhubekayo kwindawo ye-welding ukwenzela ukuba i-oksijini ikhutshwe ngokuqhubekayo kwi-outlet.

Itekhnoloji ye-nitrojeni kunye ne-fomic acid isetyenziswa ngokubanzi kwiziko lohlobo lwetonela lokuphinda liqukunjelwe kunye nokuxubana kwe-convection eyandisiweyo.I-inlet kunye ne-outlet ziyilelwe ngokubanzi ukuba zivuleke, kwaye kukho amakhethini amaninzi eminyango ngaphakathi kunye nokutywinwa okulungileyo, okunokufudumala kunye nokushisa kwangaphambili.Ukomisa, ukuphinda kufakwe i-solder kunye nokupholisa zonke zigqityiwe kwitonela.Kulo moya oxubeneyo, i-solder paste esetyenzisiweyo ayifuni ukuba ne-activators, kwaye akukho ntsalela ishiywe kwi-PCB emva kwe-soldering.Ukunciphisa i-oxidation, ukunciphisa ukubunjwa kweebhola ze-solder, kwaye akukho bhuloho, eluncedo kakhulu ekudibaniseni izixhobo ze-pitch-pitch.Igcina izixhobo zokucoca kwaye ikhusela imo engqongileyo yehlabathi.Iindleko ezongezelelekileyo ezenziwe yi-nitrogen zibuyiselwa ngokulula kugcino lweendleko ezivela kwiziphene ezincitshisiweyo kunye neemfuno zabasebenzi.

I-Wave soldering kunye ne-reflow soldering phantsi kokhuseleko lwe-nitrogen iya kuba yitekhnoloji ephambili kwindibano yomphezulu.Iring nitrogen wave soldering machine idityaniswe neteknoloji yefomic acid, kunye nesangqa senitrogen reflow soldering machine idityaniswe nomsebenzi ophantsi kakhulu wesolder paste kunye neformic acid, enokususa inkqubo yoCoca.Kwiteknoloji ye-welding ye-SMT ephuhliswayo ngokukhawuleza, ingxaki ephambili edibene nayo yindlela yokususa i-oxides, ukufumana indawo ecocekileyo yezinto ezisisiseko, kunye nokufezekisa uxhumano oluthembekileyo.Ngokuqhelekileyo, i-flux isetyenziselwa ukususa i-oxides, ukunyakamisa umphezulu ukuba uthengiselwe, ukunciphisa ukuxinana komphezulu we-solder, kunye nokuthintela ukuphinda kufakwe i-oxidation.Kodwa kwangaxeshanye, i-flux iya kushiya intsalela emva kokuthengiswa, ibangela iziphumo ezibi kumacandelo e-PCB.Ngoko ke, ibhodi yesekethe kufuneka icocwe ngokucokisekileyo.Nangona kunjalo, ubungakanani be-SMD buncinci, kwaye umsantsa phakathi kweendawo ezingathengiswanga uya usiba mncinci kwaye uncinci.Ukucoca ngokucokisekileyo akusenakwenzeka.Okubaluleke ngakumbi kukhuseleko lwendalo esingqongileyo.Ii-CFCs zibangela umonakalo kucwecwe lwe-ozone ye-atmospheric, kwaye ii-CFCs njengeyona arhente yokucoca kufuneka ivalwe.Indlela esebenzayo yokusombulula ezi ngxaki zingentla kukwamkela iteknoloji engacocekanga kwindawo yokuhlanganisana nge-elektroniki.Ukongeza inani elincinci kunye nenani le-formic acid HCOOH kwi-nitrogen ibonakalise ukuba yinto esebenzayo engacocekanga engadingi naluphi na ukucoca emva kwe-welding, ngaphandle kwemiphumo emibi okanye nayiphi na inkxalabo malunga neentsalela.